Chip module with stiffening frame and orthogonal heat spreader

ABSTRACT

An integrated circuit (IC) chip module includes a carrier, a stiffening frame, an IC chip, and a first directional heat spreader. A second directional heat spreader may further be arranged orthogonal to the first directional heat spreader. The carrier has a top surface and a bottom surface configured to be electrically connected to a motherboard. The stiffening frame includes an opening that accepts the IC chip and may be attached to the top surface of the carrier. The IC chip is concentrically arranged within the opening of the stiffening frame. The first directional heat spreader is attached to the stiffening frame and to the IC chip and generally removes heat in a first opposing bivector direction. When included in the IC chip module, the second directional heat spreader is attached to the stiffening frame and to the first directional heat spreader and generally removes heat in a second opposing bivector direction orthogonal to the first opposing bivector direction.

FIELD OF THE EMBODIMENTS

Embodiments of the present invention generally relate to electronicdevices and more specifically to an electronic device module thatincludes a carrier, integrated circuit (IC) chip, stiffening frame,and/or orthogonal heat spreader.

DESCRIPTION OF THE RELATED ART

Though the size constrains of electronic devices are generallydecreasing, the computing power of those devices are generallyincreasing. As such, electronic device will generally require high powerconsumption devices which requires the removal of an increased amount ofheat. Another approach may be to package more computing devices in asmaller area which would also require the removal of an increased amountof heat. Typically, an IC chip module is an electronic package with atleast one IC chip, semiconductor die, and the like, packaged onto acarrier or substrate.

SUMMARY

In a first embodiment of the present invention method is claimed. Themethod includes electrically connecting a IC chip module to amotherboard and thermally contacting a heat sink to the IC chip module.The IC chip module includes a carrier, a stiffening frame, asemiconductor chip, and a first direction heat spreader. The carrierincludes a top surface and a bottom surface configured to beelectrically connected to a motherboard. The stiffening frame isattached to the carrier top surface and includes a central opening thataccepts the semiconductor chip. The semiconductor chip is electricallyconnected to the carrier top surface and concentrically arranged withinthe central opening. The stiffening frame also includes a base portionand a plurality of opposing sidewalls. The first directional heatspreader thermally contacts the semiconductor chip and includes adirectionally thermally conductive material arranged to efficientlytransfer heat from the semiconductor chip in a first opposing bivectordirection towards first opposing sidewalls.

These and other embodiments, features, aspects, and advantages willbecome better understood with reference to the following description,appended claims, and accompanying drawings.

BRIEF DESCRIPTION OF THE FIGURES

So that the manner in which the above recited features of the presentinvention are attained and can be understood in detail, a moreparticular description of the invention, briefly summarized above, maybe had by reference to the embodiments thereof which are illustrated inthe appended drawings.

It is to be noted, however, that the appended drawings illustrate onlytypical embodiments of this invention and are therefore not to beconsidered limiting of its scope, for the invention may admit to otherequally effective embodiments.

FIG. 1 depicts a prior art single chip module.

FIG. 2 depicts an IC chip module, according to one or more embodimentsof the present invention.

FIG. 3-FIG. 7 depict portions of an IC chip module, according to one ormore embodiments of the present invention.

FIG. 8 depicts a method for fabricating an IC chip module, according toone or more embodiments of the present invention.

FIG. 9 depicts a method for installing an IC chip module into anelectronic device, according to one or more embodiments of the presentinvention.

FIG. 10 depicts a block diagram of an exemplary electronic device thatutilizes a IC chip module, according to one or more embodiments of thepresent invention.

DETAILED DESCRIPTION

An embodiment of the present invention is related to an IC chip modulethat includes a carrier, a stiffening frame, an IC chip, and a firstdirectional heat spreader. A second directional heat spreader mayfurther be arranged orthogonal to the first directional heat spreader.The carrier has a top surface and a bottom surface configured to beelectrically connected to a motherboard. The stiffening frame includesan opening that accepts the IC chip and may be attached to the topsurface of the carrier. The IC chip is concentrically arranged withinthe opening of the stiffening frame. The first directional heat spreaderis attached to the stiffening frame and to the IC chip and generallyremoves heat in a first opposing bivector direction. When included inthe IC chip module, the second directional heat spreader is attached tothe stiffening frame and to the first directional heat spreader andgenerally removes heat in a second opposing bivector directionorthogonal to the first opposing bivector direction.

FIG. 1 depicts a prior art electronic device 100 utilizing single chipmodule 124. Electronic device 100 may be for example a computer, server,mobile device, tablet, and the like. Single chip module 124 includeschip 102, carrier 108, interconnects 122, underfill 110, thermalinterface material 112, lid 116, and adhesive 120. Chip 102 may be anintegrated circuit, semiconductor die, processor, microchip, and thelike. Carrier 108 may be an organic carrier or a ceramic carrier andprovides mechanical support for Chip 102 and electrical paths from theupper surface of carrier 108 to the opposing side of carrier 108.Interconnects 122 electrically connect chip 102 and the upper side ofcarrier 108 and may be a wire bond, solder bond, stud, conductive ball,conductive button, and the like. Underfill 110 may beelectrically-insulating, may substantially surround interconnects 122,may isolate individual interconnects 122, and may provide mechanicalsupport between chip 102 and carrier 108. Underfill 110 may also preventdamage to individual interconnects 122 due to thermal expansionmismatches between chip 102 and carrier 108.

When chip 102 is seated upon carrier 108, a reflow process may beperformed to join interconnects 122 to electrical contacts of both chip122 and carrier 108. After chip 102 is seated to carrier 108 a lid 116is attached to carrier 108 with adhesive 120 to cover chip 102.Generally, during operation of electronic device 100, heat needs to beremoved from chip 102. In this situation, lid 116 is both a cover and aconduit for heat transfer. As such, a thermal interface material 112 maythermally join lid 116 and chip 102.

Single chip module 124 may be connected to a motherboard 106 viainterconnects 114. Motherboard 106 may be the main printed circuit boardof electronic device 100 and includes electronic components, such as agraphics processing unit, memory, and the like, and provides connectorsfor other peripherals. Interconnects 114 electrically connect the lowerside of carrier 108 to motherboard 106 and may be a wire bond, solderbond, stud, conductive ball, conductive button, and the like.Interconnects 114 may be larger and thus more robust than interconnects122. When single chip module 124 is seated upon motherboard 106 a secondreflow process may be performed to join interconnects 114 to electricalcontacts of both carrier 108 and motherboard 106. Alternately, amechanical pressurized interconnect may be established.

To assist in the removal of heat from chip 102 a heat sink 104 may bethermally joined to single chip module 124 via thermal interfacematerial 118. Heat sink 104 may be a passive heat exchanger that coolschip 102 by dissipating heat into the surrounding air. As such, duringoperation of electronic device 100, a thermal path exists from chip 102to heat sink 104 through thermal interface material 112, lid 116, andthermal interface material 118, and the like. Heat sink 104 may beconnected to motherboard 106 via one or more connection device 130.Connection device 130 may include a threaded fastener 132, standoff 134,backside stiffener 136, and fastener 138. Threaded fastener 132 mayextend through heat sink 104, standoff 134, and backside stiffener 136and provides compressive force between heat sink 104 and backsidestiffener 136. The length of standoff 134 may be selected to limit thepressure exerted upon single chip module 124 by heat sink 104 created bythe compressive forces. Backside stiffener 136 may mechanically supportthe compressive forces by distributing the forces across a larger areaof motherboard 104. In other applications, connection device 130 may bea clamp, non-influencing fastener, cam, and the like, system thatadequately forces heat sink 104 upon single chip module 124.

Referring to FIG. 2-FIG. 7 simultaneously, which depict an exemplary ICchip module 200. IC chip module 200 may include a carrier 206,stiffening frame 220, an IC chip 202, a first directional heat spreader210, and a second directional heat spreader 216.

Carrier 206 provides a base on which one or more IC chip(s) 202 aremounted and electrically connected thereto via a plurality ofinterconnects (e.g. solder, pillars, wire bonds, C4, and the like).Carrier 206 may be composed of ceramic or organic materials. If organic,carrier 206 may include multiple layers of metallization and dielectricmaterials. Depending upon the configuration of layers, carrier 206 maybe a coreless, thin core, or standard core design. The dielectricmaterials may be, for example, epoxy resin with or without fiberglassfill. In various embodiments, carrier 206 may interconnect with otherdevices such as a socket (pin grid array, land grid array, ball gridarray, and the like). In various embodiments, carrier 206 may includeother devices besides IC chip 202, for example, surface mount devices(e.g. capacitors, resistors, and the like).

IC chip 202 may be for example a die, microchip, microprocessor, graphicprocessor, combined processor and graphics processor, applicationspecific integrated circuit (ASIC), system on a chip (SOC), threedimensional integrated circuit, system on insulator (SOI), and the like.

Carrier 206 includes stiffening frame 220 that is attached to carrier206 using a high strength adhesive, such as an epoxy, and the like.Stiffening frame 220 improves carrier 206 flatness, and in particularimproves the flatness of an underside 199 of carrier 206. Stiffeningframe 220 may also particularly improve the flatness of a topside 201 ofcarrier 206. The flatness of carrier 206 at least partially allows formore efficient assembly or installation of the IC chip module 200 to thenext level of assembly (e.g. motherboard, heat sink, and the like).Stiffening frame 220 provides mechanical support for carrier 206 and maybe particular advantageous in those applications where carrier 206 isrelatively thin (e.g. coreless, thin core, and the like). Stiffeningframe 220 is made utilizing materials with a desirable mechanicalstrength (e.g. copper, nickel, stainless steel, titanium, aluminum,molded plastics, ceramics, composites or combinations of each, and thelike). Stiffening frame 220 may be made utilizing materials with adesirable CTE (e.g. similar CTE as carrier 206, and the like).Stiffening frame 220 may be made by forging, plating, stamping, molding,casting, machining, and the like. For example, stiffening frame 220 maybe made from stainless steel sheet metal.

Stiffening frame 220 includes a central opening 226. In certainembodiments, stiffening frame 220 is configured so that opening 226 isgenerally arranged so as to be substantially concentric with one or moreIC chip(s) 202. Stiffening frame 220 includes a base portion 222 and mayinclude sidewalls 224. An underside 199 of the base portion 222 isattached to the carrier 206. Sidewalls 224, if employed, extend upwardfrom a topside 201 of base portion 222 and provide additional stiffeningto in-plane bending of the overall assembly. In certain embodiments,stiffening frame 220 includes two sidewalls 224, four sidewalls 224, andthe like. Sidewall 224 topside 201 surfaces may be coplanar. In anembodiment, opposing or opposite facing sidewall 224 topside 201surfaces are coplanar.

IC chip module 200 includes an IC chip 202. IC chip 202 may be anintegrated circuit chip, semiconductor die, processor, microchip, andthe like. Interconnects electrically connect chip 202 and the topside201 of carrier 206 and may be a wire bond, solder bond, stud, conductiveball, conductive button, and the like. An underfill may beelectrically-insulating, may substantially surround the interconnects,may isolate individual interconnects, and may provide mechanical supportbetween IC chip 202 and carrier 206. Underfill may also prevent damageto individual interconnects due to thermal expansion mismatches betweenIC chip 202 and carrier 206.

IC chip module 200 includes first directional heat spreader 210. Firstdirectional heat spreader 210 generally transfers heat efficiently in afirst opposing bivector direction 213 as well as through its thickness.Opposing bivector direction 213 consists of two opposing vectors (i.e.180 degrees relative to each other). First directional heat spreader 210is made from a directionally thermally conductive material such asgraphite. In a certain embodiment, first directional heat spreader 210may be fabricated from Pyroid® HT manufactured by Minteq® PyrogenicsGroup. First directional heat spreader 210 has a higher coefficient ofthermal conductivity as compared to copper in a first opposing bivectordirection 213.

First directional heat spreader 210 thermally contacts the one or moreIC chip(s) 202. Thermally contacts shall mean efficient heat transferbetween elements achieved by the reduction of air gaps there between. Athermal interface material (TIM) may be applied to the top side 201 ofIC chip 202 and the first directional heat spreader 210 may be appliedto the top side 201 of IC chip 202 contacting the TIM. The TIM may be athermal grease, gel, and the like, as is known in the art. For example,the underside 199 of the first directional heat spreader 210 thermallycontacts the topside 201 of IC chip 202.

When attached to IC chip 202, the first directional heat spreader 210may contact stiffener base portion 222 and/or opposing sidewalls 224 ofstiffener 220. As such, the length of the first directional heatspreader 210 is approximately equal to the distance between the opposingsidewalls 224. The first directional heat spreader 210 may be press fit,interference fit, and the like, to the opposing sidewalls of stiffener220. The first directional heat spreader 210 may also be attached viaadhesive, silicone, and the like, to the base portion 222 and/oropposing sidewalls 224 of stiffener 220. For example, the underside 199of the first direction heat spreader 210 may thermally contact thetopside 201 of the base portion 222.

The first directional heat spreader 210 may be fabricated such that theopposing bivector direction 213 may generally point to the opposingsidewalls 224 of stiffener 220. In an embodiment, when attached to ICchip 202, a topside 201 surface of first directional heat spreader 210may be coplanar with the topside 201 surface of stiffening frame 220. Inanother embodiment, when attached to IC chip 202, a topside 201 surfaceof first directional heat spreader 210 may be raised relative to thetopside 201 surface of stiffening frame 220.

First directional heat spreader 210 may include a topside 201 recess212. Recess 212 may be to a depth approximately equal to half theoverall height of the first directional heat spreader 210. A top side201 of recess 212 is generally below the top side 201 of the firstdirectional heat spreader 210. A dimension “m” of first directional heatspreader 210 may be equal to a dimension “n” of recess 212. Recess 212may be centered upon a dimension “l” of first directional heat spreader210.

Contacting the stiffening frame 220 and being in thermal contact with ICchip 202, the first directional heat spreader 210 may transfer heat fromthe IC chip 202 to the opposing sidewalls 224 of stiffener 220 alongbivector direction 213.

IC chip module 200 may include a second directional heat spreader 216.Second directional heat spreader 216 generally transfers heatefficiently in a second opposing bivector direction 215 as well asthrough its thickness. Opposing bivector direction 215 consists of twoopposing vectors (i.e. 180 degrees relative to each other). Opposingbivector direction 215 is orthogonal to the opposing bivector direction213. Second directional heat spreader 216 is made from a directionallythermally conductive material such as graphite. In a certain embodiment,first directional heat spreader 216 may be fabricated from Pyroid® HTmanufactured by Minteq® Pyrogenics Group. Second directional heatspreader 216 has a higher coefficient of thermal conductivity ascompared to copper in a second opposing bivector direction 215.

Second directional heat spreader 216 thermally contacts the firstdirectional heat spreader 210. A thermal interface material (TIM) may beapplied to the top side 201 of recess 212 and the second directionalheat spreader 216 may be applied to the top side 201 of recess 212contacting the TIM. The TIM may be a thermal grease, gel, and the like,as is known in the art. For example, an underside 199 of the seconddirectional heat spreader 216 thermally contacts the topside 201 ofrecess 212. More specifically, an underside 199 of recess 218 of thesecond directional heat spreader 216 may thermally contact the topside201 of recess 212.

When attached to the first directional heat spreader 210, the seconddirectional heat spreader 216 may contact stiffener base portion 222and/or opposing sidewalls 224 of stiffener 220. As such, the length ofthe second directional heat spreader 216 is approximately equal to thedistance between the opposing sidewalls 224. The second directional heatspreader 216 may be press fit, interference fit, and the like, to theopposing sidewalls of stiffener 220. The second directional heatspreader 216 may also be attached via adhesive, silicone, and the like,to the base portion 222 and/or opposing sidewalls 224 of stiffener 220.For example, the underside 199 of the second direction heat spreader 216may thermally contact the topside 201 of the base portion 222.

The second directional heat spreader 216 may be fabricated such that theopposing bivector direction 215 may generally point to the opposingsidewalls 224 of stiffener 220. In an embodiment, when attached to thefirst directional heat spreader 210, the topside 201 surface of seconddirectional heat spreader 216 may be coplanar with the topside 201surface of stiffening frame 220 and the topside 201 surface of the firstdirectional heat spreader 210. In another embodiment, when attached tothe first directional heat spreader 210, the topside 201 surface ofsecond directional heat spreader 216 may be raised relative to thetopside 201 surface of stiffening frame 220 and be coplanar with thetopside 201 surface of the first directional heat spreader 210.

Second directional heat spreader 216 may include an underside 199 recess218. Recess 218 may be to a depth approximately equal to half theoverall height of the second directional heat spreader 216. An underside199 of recess 218 is generally above the underside 199 of the seconddirectional heat spreader 216. A dimension “p” of second directionalheat spreader 216 may be equal to a dimension “q” of recess 218. Recess218 may be centered upon a dimension “o” of second directional heatspreader 216.

Dimension “n” may be approximately equal to dimension “q” and dimension“p” may equal dimension “m” such that the second directional heatspreader 216 may juxtapose fit with first directional heat spreader 212via the fitting, linking, slotting, dovetailing, and the like, of recess218 and recess 212, respectively. The second directional heat spreader216 may be press fit, interference fit, adhered and the like, to thefirst directional heat spreader 210. The second directional heatspreader 216 may also thermally contact the first directional heatspreader 210. For example, dimensions of recess 212 and/or recess 218may be adjusted to allow for TIM material to lay between the seconddirectional heat spreader 216 and the first directional heat spreader210 upon recess 212 and recess 218 surfaces. In this instance, thecoplanarity of the topside 201 surface of second directional heatspreader 216 and the topside 201 surface of the first directional heatspreader 210 may be substantially maintained.

Contacting the stiffening frame 220, and being in thermal contact withthe first directional heat spreader 210, the second directional heatspreader 216 may transfer heat from the first directional heat spreader210 to the opposing sidewalls 224 and base 222 of stiffener 220 alongbivector direction 215.

The first directional heat spreader 210 and the second directional heatspreader 216 may be packaged together prior to thermally contacting thefirst directional heat spreader 210 with IC chip 202. For example, thefirst directional heat spreader 210 and the second directional heatspreader 216 may be packaged together (e.g., via contacting, viathermally contacting, and the like), and a thermally conductive,adhesion-promoting coating, such as Nickel plating, and the like, may bedeposited upon the first directional heat spreader 210 and the seconddirectional heat spreader 216 package.

Generally because of the increased directional coefficient of thermalconductivity, the first directional heat spreader 210 and/or the seconddirectional heat spreader 216 may remove heat from IC chip 202 moreefficiently as compared to a traditional lid 116 and assist in theefficient heat removal from IC chip module 200 to an external heat sinkby spreading heat more evenly over top sides 201 of first directionalheat spreader 210 and/or second directional heat spreader 216.

The various TIMs referenced herein, may be similar or dissimilar. TheTIMs generally reduces air gaps between elements, thereby increasingheat transfer there between. The TIMs may be a thermal gel, thermalcompound, thermal paste, heat paste, and the like. In variousembodiments, each IC chip 202 of IC chip module 200 may be thermallyjoined to an associated cover 204 with the same thickness of thermalinterface material 206. In other embodiments, the various thermalinterface materials 206 may be of differing thicknesses.

IC chip module 200 may be packaged with higher level electronic devicecomponents, such as a motherboard and/or a heat sink, according tovarious embodiments of the present invention. The electronic device maybe for example a computer, server, mobile device, tablet, and the like.IC chip module 200 may be connected to a motherboard via interconnects.Motherboard may be the main printed circuit board of the electronicdevice and includes electronic components, such as a graphics processingunit, memory, and the like, and provides connectors for otherperipherals. The interconnects electrically connect carrier 206 to themotherboard and may be a wire bond, solder bond, stud, conductive ball,conductive button, and the like. The interconnects may be larger andmore robust than the interconnects that connect the IC chip 202 with thecarrier 206. When IC chip module 200 is seated upon motherboard a secondreflow process may be performed to join interconnects to electricalcontacts of both carrier 206 and motherboard. Alternately, a mechanicalpressurized interconnect may be established.

To assist in the removal of heat from IC chip 202 a heat sink maythermally contact the IC chip module 200 via a TIM. Heat sink may be apassive heat exchanger (e.g. pin heat sink, electronic device chassis,and the like) that cools IC chip 202 by dissipating heat into thesurrounding air. The heat sink may also be an active heat exchanger(i.e. forced air, forced liquid cooling system, and the like). Morespecifically, the heat sink may thermally contact the topside 201surfaces of the first directional heat spreader 210 and the seconddirection heat spreader 216. As such, during operation of electronicdevice, a thermal path exists from IC chip 202 to the first directionalheat spreader 210 and the second direction heat spreader 216. Thethermal path may continue by transferring heat from the top sides 201 ofthe first directional heat spreader 210 and the second direction heatspreader 216 to the heat sink.

FIG. 8 depicts a method 400 for manufacturing IC chip module 200according to various embodiments of the present invention. Method 400begins at block 402 and continues with attaching stiffening frame 220 tocarrier 206 (block 404). When being attached, stiffening frame 220 maybe aligned with carrier 206 such that opening 226 is substantiallyconcentric with IC chip 202 or, if IC chip 202 is not yet installed,with locations to which IC chip 202 will be attached to carrier 206. Anadhesive may be applied to the underside 199 of stiffening frame 220 orto topside 201 of carrier 206. Depending upon the type of adhesive, acuring process may be needed to cure the adhesive.

In certain embodiments, the IC chip 202 is attached to carrier 206(block 406) by way of interconnects and underfill is applied (block408). In certain embodiments IC chip 202 is attached using a solder bumpprocesses including a solder reflow. Underfill may be applied around aportion of the perimeter of IC chip 202 and drawn thereunder bycapillary action. In some embodiments, underfill may be subject to acuring process. The curing of underfill may or may not coincide with thecuring of the adhesive connecting the stiffening frame 220 and thecarrier 206. In some embodiments, block 406 and block 408 may beperformed prior to block 202. That is, stiffening frame 220 may beattached to carrier 206 before, during, or after IC chip 202 is attachedand/or underfill is deposited.

An adhesive may be applied to stiffening frame 220. For example,adhesive may be applied to base portion 222 of stiffening frame 220and/or inner surfaces of sidewalls 224. If polymeric, adhesive 308 maybe applied by brush, dispenser, and the like. Adhesive 308 may alsoconsist of a b-staged epoxy or adhesive preform and may be pre-attachedto stiffener 220.

In various embodiments, thermal interface material may be applied to ICchip 202 and/or the underside of the first directional heat spreader 210(block 410). The first directional heat spreader 210 is attached tostiffening frame 202 and thermally contacts IC chip 202 (block 412). Invarious embodiments, another thermal interface material may be appliedto the topside 201 of first directional heat spreader recess 212 or theunderside 199 second directional heat spreader recess 218 (block 414).The second directional heat spreader 216 is attached the first heatspreader 210 (block 416). Method 400 ends at block 418.

FIG. 9 depicts a method 450 for installing a IC chip module 200 into anelectronic device according to various embodiments of the presentinvention. Method 450 begins at block 452. In certain embodiments, ICchip module 200 is attached to a motherboard via interconnects (block454). As addressed above, IC chip module 200 may be attached using asolder bump processes including a solder reflow; and in otherembodiments, IC chip module 200 may be attached to motherboard via aland grid array or ball grid array socket, or other interconnectionscheme.

A thermal interface material is applied to IC chip module 200 (block546). For example, thermal interface material may be injected, painted,spread, placed on or otherwise applied to the topside 201 surfaces ofthe first directional heat spreader 210 and the second directional heatspreader.

A heat sink may be attached to IC chip module 200 (block 458). Forexample, heat sink may be attached utilizing thermal interface material,thermal tape, epoxy, preform, and the like. Generally, a force may beapplied to secure heat sink to IC chip module 200. Method 450 ends atblock 460. A heat transfer path exists generally between the IC chip 202and the heat sink via the first directional heat spreader 210 and thesecond directional heat spreader 216.

FIG. 10 depicts a block diagram of an exemplary electronic device 300that may utilize an IC chip module 200 according to an embodiment of thepresent invention. It should be appreciated that FIG. 10 provides onlyan illustration of one implementation of an embodiment of the presentinvention and does not imply any limitations with regard to theenvironment in which different embodiments may be implemented.

Electronic device 300 includes communications bus 552, which providescommunications between IC chip module (s) 200, memory 556, persistentstorage 558, communications unit 560, and input/output (I/O)interface(s) 562. Memory 556 may be, for example, one or more randomaccess memories (RAM) 564, cache memory 566, or any other suitablenon-volatile or volatile storage device. Persistent storage 558 caninclude one or more of flash memory, magnetic disk storage device of aninternal hard drive, a solid state drive, a semiconductor storagedevice, read-only memory (ROM), EPROM, or any other computer-readabletangible storage device that is capable of storing program instructionsor digital information.

The media used by persistent storage 558 may also be removable. Forexample, a removable hard drive may be used for persistent storage 558.Other examples include an optical or magnetic disk that is inserted intoa drive for transfer onto another storage device that is also a part ofpersistent storage 558, or other removable storage devices such as athumb drive or smart card.

Communications unit 560 provides for communications with otherelectronic devices. Communications unit 560 includes one or more networkinterfaces. Communications unit 560 may provide communications throughthe use of either or both physical, optical and wireless communicationslinks. In other embodiments, electronic device 200 may be devoid ofcommunications unit 560. Software may be downloaded to persistentstorage 558 through communications unit 560.

I/O interface(s) 562 allows for input and output of data with otherdevices that may be connected to electronic device 200. For example, I/Ointerface 562 may provide a connection to external devices 568 such as acamera, mouse, keyboard, keypad, touch screen, and/or some othersuitable input device. I/O interface(s) 562 also connects to display570.

Display 570 provides a mechanism to display data to a user and may be,for example, a computer monitor. Alternatively, display 570 may beintegral to electronic device 200 and may also function as a touchscreen.

The accompanying figures and this description depicted and describedembodiments of the present invention, and features and componentsthereof. Those skilled in the art will appreciate that any particularprogram nomenclature used in this description was merely forconvenience, and thus the invention should not be limited to use solelyin any specific application identified and/or implied by suchnomenclature.

The descriptions of the various embodiments of the present inventionhave been presented for purposes of illustration, but are not intendedto be exhaustive or limited to the embodiments disclosed. Manymodifications and variations will be apparent to those of ordinary skillin the art without departing from the scope and spirit of the describedembodiments. The terminology used herein was chosen to best explain theprinciples of the embodiment, the practical application or technicalimprovement over technologies found in the marketplace, or to enableothers of ordinary skill in the art to understand the embodimentsdisclosed herein.

References herein to terms such as “vertical”, “horizontal”, and thelike, are made by way of example, and not by way of limitation, toestablish a frame of reference. The term “horizontal” as used herein isdefined as a plane parallel to the conventional plane or surface of thecarrier 206, regardless of the actual spatial orientation of the carrier206. The term “vertical” refers to a direction perpendicular to thehorizontal, as just defined. Terms, such as “on”, “above”, “below”,“side” (as in “sidewall”), “higher”, “lower”, “over”, “top”, “under”,“beneath”, and the like, are defined with respect to the horizontalplane. It is understood that various other frames of reference may beemployed for describing the present invention without departing from thespirit and scope of the present invention.

What is claimed is:
 1. A method comprising: electrically connecting a ICchip module to a motherboard and thermally contacting a heat sink to theIC chip module, wherein the IC chip module comprises: a carriercomprising a top surface and a bottom surface configured to beelectrically connected to a motherboard; a stiffening frame attached tothe carrier top surface, the stiffening frame comprising a centralopening that accepts a semiconductor chip; a semiconductor chipelectrically connected to the carrier top surface and concentricallyarranged within the central opening, a base portion and a plurality ofopposing sidewalls; and a first directional heat spreader thermallycontacting the semiconductor chip, the first directional heat spreadercomprising a directionally thermally conductive material arranged toefficiently transfer heat from the semiconductor chip in a firstopposing bivector direction towards first opposing sidewalls.
 2. Themethod of claim 1, wherein the first directional heat spreader contactsthe first opposing sidewalls.
 3. The method of claim 1, wherein the ICchip module further comprises: a second directional heat spreaderthermally contacting the first directional heat spreader, the seconddirectional heat spreader transferring heat from the first directionalheat spreader in a second opposing bivector direction towards secondopposing sidewalls.
 4. The method of claim 3, wherein a topside of thefirst directional heat spreader is coplanar with a topside of the seconddirectional heat spreader.
 5. The method of claim 3, wherein the firstopposing bivector direction and the second opposing bivector directionare orthogonal.
 6. The method of claim 3, wherein the second directionalheat spreader contacts the second opposing sidewalls.